FEATURED
Yutai Su,
Xu Long,
Chuantong Chen,
Xujiang Chao,
Bo Wan
Frontiers Media SA
In the swiftly progressing landscape of the electronics industry, the investigation of advanced electronic packaging materials stands as an essential frontier for technological breakthroughs. This...
Engineering
Materials
Semiconducting Materials and Devices
Keywords: advanced electronics packaging,Constitutive model,Multi-physics simulation,Design optimizations,Reliability assessment