Review of printed electrodes for flexible devices
- 1East China Normal University, China
- 2Tsinghua University, China
Printed electronic technologies draw tremendous attention worldwide due to their ability to surpass the limitations of traditional high-cost electronics based on rigid silicon and manufacture various devices on flexible substrates. As a critical component of flexible electronics, electrodes fabricated on soft, bendable and stretchable substrates are of great importance. Based on the fabrication process, this paper classifies the mainstream technologies into two categories: top-down and bottom-up. To be specific, the top-down technology includes physical evaporation methods, printing technologies and soft lithography and the bottom-up technology involves polymer-assisted-metal-deposition methods and ion-exchange methods, respectively. In contrast to the top-down technology that transfers the functional ink onto the substrate directly, the bottom-up methods achieve great improvement in the adhesion between the substrates and the metal electrodes. In the end of the paper, the challenges for top-down technologies, including costs, synthesis and choice of ink for printing technologies, the limited choice of metal for bottom-up technologies and the mass production of these methods are also discussed.
Keywords: printed electrodes, Flexible devices, Electronic devices, Metal nanomaterials, Ion-exchange technology
Received: 30 Oct 2018;
Accepted: 11 Dec 2018.
Edited by:Xiangheng Xiao, Wuhan University, China
Reviewed by:Weida Hu, Shanghai Institute of Technology, China
Wenzhong Bao, Fudan University, China
Copyright: © 2018 Li, Zhang, Li, Li, Tian, Luo, Qiao, Wu and Zhang. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) and the copyright owner(s) are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
Prof. Xing Wu, East China Normal University, Shanghai, 200062, Shanghai Municipality, China, firstname.lastname@example.org
Prof. Jian Zhang, East China Normal University, Shanghai, 200062, Shanghai Municipality, China, email@example.com