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Original Research ARTICLE Provisionally accepted The full-text will be published soon. Notify me

Front. Mater. | doi: 10.3389/fmats.2019.00300

The coupling effect of lead and polishing treatments on the passive films of Alloy 690TT in high temperature and pressure water

 Weipeng Li1, Jianying He2 and Lijie Qiao1*
  • 1University of Science and Technology Beijing, China
  • 2Norwegian University of Science and Technology, Norway

In pressurized water reactors, the existence of lead contamination can promote the corrosion of Alloy 690TT. During the manufacturing, transportation and assembly processes, Alloy 690TT surface are easily scratched and it’s easily ignored. The effect of added lead on the scratched surface is different from that on unscratched surface. In the present study, Alloy 690TT were treated with mechanical polishing (MP) and electrochemical polishing (EP) to generate scratched and unscratched surfaces. With the addition of lead, the thickness of passive film on the MP sample increases by 8 times, while that on the EP sample only slightly increases. These chemical composition changes of passive films induced by lead result in the drop of their electrical resistivity, and the electrical resistivity of passive film on the MP sample is reduced by two orders of magnitude, while that on the EP sample decreases only 3 times. Nevertheless, the thickness and electrical resistivity of passive film on the MP sample are always greater than those of the EP sample. The toxic effect of lead on the MP sample is more severe than that of the EP sample, which may be closely related to their subsurface microstructure. Therefore, Alloy 690TT should better avoid being scratched in secondary circuit system of pressurized water reactors, as scratched behavior will result in a faster corrosion rate of Alloy 690TT with the presence of lead.

Keywords: Lead, Alloy 690TT, Mechanical polishing, Electrochemical polishing, Passive film, electrical resistivity

Received: 31 Aug 2019; Accepted: 08 Nov 2019.

Copyright: © 2019 Li, He and Qiao. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) and the copyright owner(s) are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.

* Correspondence: Mx. Lijie Qiao, University of Science and Technology Beijing, Beijing, China,