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ORIGINAL RESEARCH article

Front. Mater.
Sec. Polymeric and Composite Materials
Volume 11 - 2024 | doi: 10.3389/fmats.2024.1415283

Fabrication of electrically conductive microparts by constructing carbon black-rich network under high shear conditions in microinjection molding Provisionally Accepted

Xue Lei1 Xiaoxi Gong1 Jixiang Li1 You Shi2 Zhongguo Zhao3 Mei Liang1 Huawei Zou1  Shengtai Zhou1*
  • 1Sichuan University, China
  • 2Nanjing Chenguang Group Co., Ltd., China
  • 3Shaanxi University of Technology, China

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Microinjection molding (μIM) is an important technique to fabricate microparts for applications in the fields of automotive and microelectromechanical systems. However, the prevailing high shear conditions in μIM is unfavorable for constructing intact electrically conductive networks because the added fillers tend to be preferentially aligned along the melt flow direction. In this work, a series of polypropylene/polyamide 6/carbon black (PP/PA6/CB) composites with a selective localization of CB in the PA6 phase were used as the model system to prepare electrically conductive microparts. The prevailing high shearing and extensional flow effects in μIM were utilized to deform CB-rich phase with an aim to in situ construct electrically conductive network, thereby improving the electrical conductivity (σ) of subsequent moldings. The results indicated that a higher σ was achieved for PP/PA6/CB microparts when compared with their PP/CB and PA6/CB counterparts, at a lower filler content (<10 wt%). The influence of blending sequence of various components (i.e., PP, PA6, and CB) and annealing treatment on the σ of microparts was also studied. This work provided an approach to the design and preparation of electrically conductive microparts that can be potentially used in high-tech sectors.

Keywords: Microinjection molding, Immiscible blend, electrical conductivity, carbon black, microstructure

Received: 10 Apr 2024; Accepted: 23 May 2024.

Copyright: © 2024 Lei, Gong, Li, Shi, Zhao, Liang, Zou and Zhou. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.

* Correspondence: Mx. Shengtai Zhou, Sichuan University, Chengdu, China