Research Topic

Novel Materials for Green Soldering and Brazing

About this Research Topic

In soldering and brazing field, Pb and Cd were known as the main elements in interconnection materials. Traditionally, Sn-Pb solders and Ag-Cu-Cd filler metals are the most widely used interconnection alloys in electronic devices and electrical products. However, both Pb and Cd have been identified as hazardous to human health due to their toxic behaviors. Banning of such toxic materials by RoHS (Restriction of Hazardous Substances) has propelled the entire electronics industry to find alternative and sustainable replacements. As a result, the industries are striving to find viable Pb-free solders and Cd-free filler metals. The research focus has been on designing alternative replacements with the right properties, including wettability, melting point, cost, availability, strength, corrosion resistance, thermal fatigue, etc.

This Research Topic will focus on the recent development in advanced materials for green soldering and brazing. It will provide a platform for researchers to share the latest research progress of processing, characterization, and modeling of soldering and brazing materials. This Research Topic is aimed to compile recent research findings by researchers from academia, industry, and government research laboratory. Potential subjects include:

• the fabrication methods of Pb-free solders and Cd-free filler metals for green soldering and brazing
• elements alloying of Pb-free solders and Cd-free filler metals and related processing
• particles strength of Pb-free solders and Cd-free filler metals and related processing
• reliability of Pb-free solder joints and Cd-free joints


Keywords: soldering, brazing, filler metal, interconnection materials


Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.

In soldering and brazing field, Pb and Cd were known as the main elements in interconnection materials. Traditionally, Sn-Pb solders and Ag-Cu-Cd filler metals are the most widely used interconnection alloys in electronic devices and electrical products. However, both Pb and Cd have been identified as hazardous to human health due to their toxic behaviors. Banning of such toxic materials by RoHS (Restriction of Hazardous Substances) has propelled the entire electronics industry to find alternative and sustainable replacements. As a result, the industries are striving to find viable Pb-free solders and Cd-free filler metals. The research focus has been on designing alternative replacements with the right properties, including wettability, melting point, cost, availability, strength, corrosion resistance, thermal fatigue, etc.

This Research Topic will focus on the recent development in advanced materials for green soldering and brazing. It will provide a platform for researchers to share the latest research progress of processing, characterization, and modeling of soldering and brazing materials. This Research Topic is aimed to compile recent research findings by researchers from academia, industry, and government research laboratory. Potential subjects include:

• the fabrication methods of Pb-free solders and Cd-free filler metals for green soldering and brazing
• elements alloying of Pb-free solders and Cd-free filler metals and related processing
• particles strength of Pb-free solders and Cd-free filler metals and related processing
• reliability of Pb-free solder joints and Cd-free joints


Keywords: soldering, brazing, filler metal, interconnection materials


Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.

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Submission Deadlines

10 December 2020 Manuscript

Participating Journals

Manuscripts can be submitted to this Research Topic via the following journals:

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Topic Editors

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Submission Deadlines

10 December 2020 Manuscript

Participating Journals

Manuscripts can be submitted to this Research Topic via the following journals:

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