About this Research Topic
Boiling heat transfer has proven to be the most effective ways to dissipate a large amount of heat fluxes and achieve efficient cooling in many applications including batteries, high-power electronics, refrigeration, and air conditioning. With the aggressive net-zero carbon footprint goals set up by the numerous industries across the globe, the need for development of innovative heat dissipation techniques is on the rise.
Abundant research studies are currently available on boiling heat transfer focused towards enhancing the Critical Heat Flux (CHF) and Heat Transfer Coefficient (HTC). The CHF value defines the heat transfer limit prior to temperature shoot, most applications operate in the nucleate boiling regime and CHF establishes the thermal threshold. The HTC defines the heat dissipation efficiency of the system and high HTC value results in reduced thermal resistance.
However, most of these research studies have been performed on surface geometries which are different from actual heat sinks/cold plate designs used in the industry. Therefore, further research and efforts are required in order to apply directly in electronics cooling applications since the chip size and heat dissipation areas are much larger in industrial applications.
The purpose of this Research Topic is to provide a dedicated platform wherein the focus is mainly on developing heat transfer enhancement techniques which can have direct applications in the electronics cooling and/or more relevant techniques which can be implemented in the industrial applications. Two-phase heat transfer techniques (either pool boiling or flow boiling) applied directly on various electronic components such as data centers or CPU chips will be a valuable addition in this topic. The research work can be theoretical, numerical, and experimental with any active or passive enhancement methods. Techniques to advance computer modeling and experiments to analyze nano, micro, and large-scale heat transfer systems are also encouraged.
We aim to provide such engineered solutions in two-phase cooling that can help to move the field of boiling heat transfer one step closer to making it a reality. All types of articles are welcome (Original Research, Review, Methods, Hypothesis and Theory, and Mini Review).
Abundant research studies are currently available on boiling heat transfer focused towards enhancing the Critical Heat Flux (CHF) and Heat Transfer Coefficient (HTC). The CHF value defines the heat transfer limit prior to temperature shoot, most applications operate in the nucleate boiling regime and CHF establishes the thermal threshold. The HTC defines the heat dissipation efficiency of the system and high HTC value results in reduced thermal resistance.
However, most of these research studies have been performed on surface geometries which are different from actual heat sinks/cold plate designs used in the industry. Therefore, further research and efforts are required in order to apply directly in electronics cooling applications since the chip size and heat dissipation areas are much larger in industrial applications.
The purpose of this Research Topic is to provide a dedicated platform wherein the focus is mainly on developing heat transfer enhancement techniques which can have direct applications in the electronics cooling and/or more relevant techniques which can be implemented in the industrial applications. Two-phase heat transfer techniques (either pool boiling or flow boiling) applied directly on various electronic components such as data centers or CPU chips will be a valuable addition in this topic. The research work can be theoretical, numerical, and experimental with any active or passive enhancement methods. Techniques to advance computer modeling and experiments to analyze nano, micro, and large-scale heat transfer systems are also encouraged.
We aim to provide such engineered solutions in two-phase cooling that can help to move the field of boiling heat transfer one step closer to making it a reality. All types of articles are welcome (Original Research, Review, Methods, Hypothesis and Theory, and Mini Review).
Keywords: Two-phase heat transfer, Electronics cooling, Heat transfer coefficient, Efficient cooling, Heater size scaling
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