About this Research Topic
Molecular science and engineering have evolved into an exciting stage which foster many exciting frontiers include advanced electronic materials. From silicon wafers, photoresist, thin films, to adhesives, high purity reagent, thermal management materials et al. it supports and pushes the semiconductor industry to next level.
By designing and creating new molecules, assembly to form advanced structures, interesting and exciting properties emerge. These enable more powerful device, circuit and advanced artificial Intelligence. Along this line, we are very excited to initiate this special issue to share most significant progress in the field of advanced electronic materials.
The themed issue entitled: Advanced Electronic Materials-From Molecular Design, Assembly to Device, Circuit and Intelligence welcome submission from frontiers of electronic materials such as electronic packaging materials and 3D heterogeneous integrated materials. It wishes to provide a platform for interdisciplinary collaboration and communication in advanced electronic materials. Thanks to the research progress in the field of advanced electronic materials and the continuous technical innovation in 3D packaging and stacked packaging make Moore's law continue. The goal of this special issue is to systematically summarizing the exciting achievements and progress in the field of advanced electronic materials, but also share critical vision and mission for future semiconductor industry.
The main content includes but not limited to the following area:
• Electronic Packaging Materials
• Electronic cleaning agents and equipment
• 3D heterogeneous integrated materials
• Hybrid and composite materials for electronics
By designing and creating new molecules, assembly to form advanced structures, interesting and exciting properties emerge. These enable more powerful device, circuit and advanced artificial Intelligence. Along this line, we are very excited to initiate this special issue to share most significant progress in the field of advanced electronic materials.
The themed issue entitled: Advanced Electronic Materials-From Molecular Design, Assembly to Device, Circuit and Intelligence welcome submission from frontiers of electronic materials such as electronic packaging materials and 3D heterogeneous integrated materials. It wishes to provide a platform for interdisciplinary collaboration and communication in advanced electronic materials. Thanks to the research progress in the field of advanced electronic materials and the continuous technical innovation in 3D packaging and stacked packaging make Moore's law continue. The goal of this special issue is to systematically summarizing the exciting achievements and progress in the field of advanced electronic materials, but also share critical vision and mission for future semiconductor industry.
The main content includes but not limited to the following area:
• Electronic Packaging Materials
• Electronic cleaning agents and equipment
• 3D heterogeneous integrated materials
• Hybrid and composite materials for electronics
Keywords: Advanced Electronic Materials, Electronic Packaging Materials, Electronic cleaning agents and equipment, 3D heterogeneous integrated materials, Hybrid and composite materials for electronics
Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.
