Photonic Integrated Circuits (PICs) have experienced significant advancements over the past few decades, driven by innovations in material growth, processing, and design capabilities. The mainstream technologies, including Indium Phosphide (InP), Silicon-on-Insulator (SOI), and Silicon Nitride (SiN), have evolved to a point where they are now considered generic platforms by multiple foundries worldwide. The rapid maturation of silicon and III-V photonic platforms has transitioned from basic device proof-of-concepts to systems-level integration. InP is particularly notable for its ability to integrate all active functionalities such as light generation, modulation, and detection. Conversely, silicon, despite requiring an external light source, offers exceptional passive components, efficient modulators, and detectors on a more economical and scalable platform. The integration of these technologies promises size and cost reduction, enhanced stability and reliability, faster processing speeds, larger information capacity, higher energy efficiency, and greater versatility. However, challenges remain, particularly in the heterogeneous integration of different materials to achieve expanded functionality and higher integration densities, which are crucial for new application domains.

This Research Topic aims to highlight the most compelling breakthroughs in the field of Photonic Integrated Circuits, with a special focus on the heterogeneous integration of functional materials for applications beyond the traditional telecommunications wavelength range, including UV, visible, and mid-IR spectral ranges. The primary objectives are to explore new material platforms, fabrication and characterization technologies, device physics and architectures, and design principles for miniaturized components and devices. Specific questions to be addressed include how to overcome technological obstacles for heterogeneous integration, how to enhance performance and functionality, and how to expand the application domains of integrated photonics.

To gather further insights into the boundaries of this research, we welcome articles addressing, but not limited to, the following themes:

• Heterogeneous integration of various material platforms for active functions.
• Nonlinear integrated photonics and applications.
• Reconfigurable integrated photonics.
• Integrated photonics beyond telecom wavelengths.
• Novel micro- and nanophotonic structures.
• Novel materials, manufacturing, and packaging approaches for photonic integrated circuits.

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Innovative Material Platforms and Architectures for Next-Generation Photonic Integrated Circuits