Thermal management systems, controlling the dispersion, storage, and conversion of heat, were widely used in various fields, ranging from commercial to military applications. With increased performance requirements for smaller, more capable, and more efficient power devices, the overheating problem becomes an increasingly challenging problem. To address this pressing issue, the need for advanced thermal management materials and technologies has been recognized as a challenge in thermal sciences research to provide continuous improvements in device and system performance.
The purpose of this Research Topic is to present the recent progress of thermal management in various applications, including data centers, electric vehicles, 5G telecom infrastructure, electrical equipment, microelectronic packaging, etc. We hope to advance the understanding of fundamental heat and mass transport mechanisms in thermal management materials and related heat transfer enhancement methods, the development of thermal management techniques to control the temperature for low energy consumption and optimized performance, and the development of innovative thermal management solutions.
Original research and review (mini-review) articles including, but not limited to the following areas of interest are welcome:
1. Thermophysical properties of thermal management materials.
2. Mechanisms of heat and mass transfer enhancement in composite materials.
3. Advanced techniques to enhance condensation or boiling heat transfer.
4. Thermal transport in interface materials, packaging materials, thermoelectric materials, and thermal storage materials.
5. Analysis or optimization of thermal management methods including air, liquid, phase change material, thermoelectric cooling, heat pipe, and hybrid strategy.
6. Advanced theories and techniques for the novel thermal management system.
Thermal management systems, controlling the dispersion, storage, and conversion of heat, were widely used in various fields, ranging from commercial to military applications. With increased performance requirements for smaller, more capable, and more efficient power devices, the overheating problem becomes an increasingly challenging problem. To address this pressing issue, the need for advanced thermal management materials and technologies has been recognized as a challenge in thermal sciences research to provide continuous improvements in device and system performance.
The purpose of this Research Topic is to present the recent progress of thermal management in various applications, including data centers, electric vehicles, 5G telecom infrastructure, electrical equipment, microelectronic packaging, etc. We hope to advance the understanding of fundamental heat and mass transport mechanisms in thermal management materials and related heat transfer enhancement methods, the development of thermal management techniques to control the temperature for low energy consumption and optimized performance, and the development of innovative thermal management solutions.
Original research and review (mini-review) articles including, but not limited to the following areas of interest are welcome:
1. Thermophysical properties of thermal management materials.
2. Mechanisms of heat and mass transfer enhancement in composite materials.
3. Advanced techniques to enhance condensation or boiling heat transfer.
4. Thermal transport in interface materials, packaging materials, thermoelectric materials, and thermal storage materials.
5. Analysis or optimization of thermal management methods including air, liquid, phase change material, thermoelectric cooling, heat pipe, and hybrid strategy.
6. Advanced theories and techniques for the novel thermal management system.
