Ultrafast laser machining of transparent materials constitutes an extremely accurate method to create 3D networks of photonics or microfluidic circuits with micrometer or even nanometer accuracy.
The process involves the use of short laser pulses with high peak intensities (~1013 W/cm2) that are focused on the surface or inside the volume of the material. Due to the extremely high irradiance, nonlinear absorption is induced and, as a consequence, a permanent modification of the material is produced in the focal region. Translating the substrate in three dimensions it is possible to inscribe arbitrary structures within the volume of the material or to directly ablate with a minimal heat-affected zone. The process is highly versatile as one may modify a huge number of different materials ranging from glass, to crystals, photopolymer, or even metals.
The unique characteristics of this technology have triggered its application in several different technological fields such as biology, chemistry, quantum computing, or strong laser field manipulations.
This Research Topic aims to highlight the latest achievements in ultrafast-laser-fabrication of integrated optical components and microfluidic lab-on-a-chip devices. It seeks to showcase research papers, short communications, and review articles that focus on:
- Drilling, cutting, and welding
- Ultrafast laser micromachining
- Multiphoton polymerization
- Sensoring
- Microfluidics
- Lab-on-a-chip
- Bio-photonics
- Integrated Optics
Keywords:
Ultrafast Laser Mciromachining, Integrated Optics, Optofluidics, Hollow Waveguides, Lab-on-a-Chip.
Important Note:
All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.
Ultrafast laser machining of transparent materials constitutes an extremely accurate method to create 3D networks of photonics or microfluidic circuits with micrometer or even nanometer accuracy.
The process involves the use of short laser pulses with high peak intensities (~1013 W/cm2) that are focused on the surface or inside the volume of the material. Due to the extremely high irradiance, nonlinear absorption is induced and, as a consequence, a permanent modification of the material is produced in the focal region. Translating the substrate in three dimensions it is possible to inscribe arbitrary structures within the volume of the material or to directly ablate with a minimal heat-affected zone. The process is highly versatile as one may modify a huge number of different materials ranging from glass, to crystals, photopolymer, or even metals.
The unique characteristics of this technology have triggered its application in several different technological fields such as biology, chemistry, quantum computing, or strong laser field manipulations.
This Research Topic aims to highlight the latest achievements in ultrafast-laser-fabrication of integrated optical components and microfluidic lab-on-a-chip devices. It seeks to showcase research papers, short communications, and review articles that focus on:
- Drilling, cutting, and welding
- Ultrafast laser micromachining
- Multiphoton polymerization
- Sensoring
- Microfluidics
- Lab-on-a-chip
- Bio-photonics
- Integrated Optics
Keywords:
Ultrafast Laser Mciromachining, Integrated Optics, Optofluidics, Hollow Waveguides, Lab-on-a-Chip.
Important Note:
All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.