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1 article related to "Die To Wafer Bonding"

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Articles

Original Research

Published on 07 Apr 2015

High-Throughput Multiple Dies-to-Wafer Bonding Technology and III/V-on-Si Hybrid Lasers for Heterogeneous Integration of Optoelectronic Integrated Circuits

in Optics and Photonics

Xianshu Luo
Yulian Cao
Junfeng Song
Xiaonan Hu
Yuanbing Cheng
Chengming Li
Chongyang Liu
Tsung-Yang Liow
Mingbin Yu
Hong Wang

Frontiers in Materials

doi 10.3389/fmats.2015.00028

25,715 views
44 citations