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1 article related to "Through Silicon Vias"

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Articles

Original Research

Published on 14 Oct 2020

Effect of Pulse Current and Pre-annealing on Thermal Extrusion of Cu in Through-Silicon via (TSV)

in Electrochemistry

Youjung Kim
Sanghyun Jin
Kimoon Park
Jinhyun Lee
Jae-Hong Lim
Bongyoung Yoo

Frontiers in Chemistry

doi 10.3389/fchem.2020.00771

6,443 views
16 citations