Intermetallic Compound | List of Frontiers open access articles

Original Research

Published on 04 Jan 2023

Interfacial intermetallic compound modification to extend the electromigration lifetime of copper pillar joints

in Structural Materials

Dongsheng Yang
Yilong Huang

Frontiers in Materials

doi 10.3389/fmats.2022.1080848

3,476 views
2 citations

Original Research

Published on 24 Oct 2022

Research on the Phase Transformation of a Newly Developed Carbonitride-Strengthened Martensitic Heat Resistant Steel

in Structural Materials

Wenfeng Zhang
Ping Pan
Jun Zhou
Wei Xiong
Yunqiang Liu
Xiaogang Liu
Wei Yan

Frontiers in Materials

doi 10.3389/fmats.2022.803596

2,895 views

Original Research

Published on 04 Sep 2024

Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints under current stressing

in Mechanics of Materials

Bo Wang
Wangyun Li
Kailin Pan
Wei Huang
Yubing Gong

Frontiers in Materials

doi 10.3389/fmats.2024.1452773

1,718 views
4 citations

Mini Review

Published on 15 Apr 2025

Review on the impact of marine environment on the reliability of electronic packaging materials

in Polymeric and Composite Materials

Fengyong Lang
Zhenrui Zhou
Jia Liu
Meng Cui
Zhongqing Zhang

Frontiers in Materials

doi 10.3389/fmats.2025.1584349

3,713 views
4 citations

Original Research

Published on 02 Sep 2024

Lifetime prediction of copper pillar bumps based on fatigue crack propagation

in Polymeric and Composite Materials

Yuege Zhou
Qingsheng Liu
Tengfei Ma
Shupeng Li
Xinyu Zhang

Frontiers in Materials

doi 10.3389/fmats.2024.1470365

3,817 views
2 citations

Original Research

Published on 26 Nov 2020

Crystal Structure Prediction of Binary Alloys via Deep Potential

in Theoretical and Computational Chemistry

Haidi Wang
Yuzhi Zhang
Linfeng Zhang
Han Wang

Frontiers in Chemistry

doi 10.3389/fchem.2020.589795

9,019 views
34 citations

Original Research

Published on 24 Mar 2022

Effect of Grain Structure on the Failure Mechanism of Cu/Cu3Sn Investigated Via Molecular Dynamic Simulations

in Semiconducting Materials and Devices

Jicheng Zhang
Zhitao Jiang
Yuanxiang Zhang

Frontiers in Materials

doi 10.3389/fmats.2022.860708

3,990 views
2 citations

Articles

Interfacial intermetallic compound modification to extend the electromigration lifetime of copper pillar joints

Research on the Phase Transformation of a Newly Developed Carbonitride-Strengthened Martensitic Heat Resistant Steel

Size dependence on shear fatigue and fracture behavior of ball grid array structure Cu/Sn–3.0Ag–0.5Cu/Cu solder joints under current stressing

Review on the impact of marine environment on the reliability of electronic packaging materials

Lifetime prediction of copper pillar bumps based on fatigue crack propagation

Crystal Structure Prediction of Binary Alloys via Deep Potential

Effect of Grain Structure on the Failure Mechanism of Cu/Cu3Sn Investigated Via Molecular Dynamic Simulations