ORIGINAL RESEARCH article
Front. Dent. Med.
Sec. Dental Materials
Volume 6 - 2025 | doi: 10.3389/fdmed.2025.1685381
This article is part of the Research TopicAdvances in Dental Science: Innovations in Technology and BiomaterialsView all articles
The effect of etching times of phosphoric acid on the bond strength of enamel with or without erosion using universal adhesives
Provisionally accepted
- 1Nanchang University, Nanchang, China
- 2Peking University, Beijing, China
- 3Beijing Hospital of Traditional Chinese Medicine, Beijing, China
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This study evaluates the effect of etching times of phosphoric acid on the bond strength of universal adhesives (UAs) on enamel with or without erosion (0.3% citric acid with pH 2.6 for 5 min, 4 times a day, for 5 consecutive days). Flat polished bovine incisors (n = 60) were divided into two groups according to different enamel conditions, which was further divided into three subgroups (n = 10) according to the etching times of phosphoric acid at 0 s (self-etch/SE mode), 3 s and 15 s (etch-and-rinse/ER mode). Shear bond strength (SBS) test was performed after applying UAs and composite blocks. Surface topography and roughness were assessed after the treatment of phosphoric acids on both enamel conditions by scanning electron microscopy (SEM) and profilometer respectively. For normal enamel, SBS values were significantly higher in ER mode, while neither the etching times of phosphoric acid nor the etching modes affected the SBS and roughness of eroded enamel. Briefly, SE mode of UAs may be sufficient for eroded enamel, while reducing etching time of phosphoric acid to 3 s may be acceptable for sound enamel with resin restoration on instant performance.
Keywords: Dental erosion, enamel, shear bond strength, Universal adhesives, Phosphoric acid
Received: 13 Aug 2025; Accepted: 29 Sep 2025.
Copyright: © 2025 Huang, Chai and Niu. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
* Correspondence: Guangliang Niu, newgl@sina.com
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