Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability

Published in

Frontiers in Materials

• Polymeric and Composite Materials

• Semiconducting Materials and Devices

• 2.9 impact factor
• 5.6 citescore

Participating Journals

• Frontiers in Electronic Materials

  • Semiconducting Materials and Devices

Manuscripts can be submitted to this Research Topic via the main journal or any other participating journal.

Impact

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