Abstract
Two-dimensional (2D) layered semiconductors are current research hotspots on account of their wide variety of applications in electronics and optoelectronics due to their particular ultrathin nature. In this review, the band alignment engineering in heterojunctions composed of 2D van der Waals (vdW) layered semiconductors and their device applications in optoelectronics are provided. Various approaches that induced adjustability of vdW heterojunctions are summarized, mainly including composition and thickness modulations, strain, and electric fields. Furthermore, their perspectives on future developments in optoelectronics and electronics devices based on the newly unique physical and chemical properties are outlined.
1 Introduction
According to “Moore’s law,” the number of transistors that can be placed on an integrated circuit doubles roughly every 18 months, and this rapid development depends on the constant upgrading of electronic components. Unfortunately, the rapid development speed hits a bottleneck as the characteristic size of circuit precision decreases to a few nanometers, at a level where heat dissipation becomes the biggest obstacle. The European Centre for Microelectronics suggested that two-dimensional (2D) materials become the only option for further miniaturization of chips last year, and the newly emerged 2D layered materials show great potential in applications in photoelectric and electric devices (; ; ; ). With strong covalent bonding within the layer and van der Waals (vdW) interaction between layers (), 2D layered materials have special physical structures and chemical properties, including unique layer-dependent features (; ), high carrier mobility (; ; ), and large exciton binding energy (; ).
The performance of van der Waals heterojunctions (vdWHs) composed of multilayer semiconductors is seriously affected by the band alignments at the interface (). As shown in Figure 1A, semiconductor van der Waals heterojunctions (vdWHs) can be classified into type I (symmetric), type II (staggered), and type III (broken) according to band arrangement of semiconductors (; ). The type-I heterojunctions are suitable for applications in photoluminescence and photoluminescence excitation detections (), since the photo-excited electrons tend to transfer within the CBM and VBM of the narrow bandgap rather than in the broad one, spatially confine the charge carriers, and efficiently reduce the undesirable dissociation of excitons, which in turn greatly improve the exciton efficiency (). Type II heterojunctions are widely used for photoelectric, photocatalysis, and unipolar electronic devices (), with the staggered band alignment which spatially separated holes and electrons. For type-III heterojunctions, the bandgap is broken, and the large band overlap between layers allows easier interlayer charge transfer (; ), which facilities type-III heterojunction construct vdW Esaki tunnel diodes ().
FIGURE 1
Nowadays, vdWHs with different band alignments are constructed, and the resulting devices are gradually becoming the alternative to the widely used silicon-based devices. As a result, many approaches to modulate the band alignment in heterojunctions have evolved. Here, we mainly introduce these approaches and the application of vdWHs in photoelectric and electronic devices.
2 Band Alignment Engineering
Band alignment engineering governs the charge transport behavior in heterojunctions, so it is an efficient way to regulate the photoelectric and electrical properties through bandgap edge adjustment. There are many ways to regulate the band arrangement, such as composition modulation, component thickness, strain, and electric field.
Integrated by two (or more) kinds of semiconductors, the properties of heterojunctions are greatly influenced by the components, especially for the vdW layered heterojunctions composed of 2D dangling bond free surface layers (
Transition metal dichalcogenides (TMDs) are the most widely used 2D semiconductors, and the heterojunctions based on TMDs covered the three types of band arrangements. Type-II band alignment is common in TMD heterojunctions; furthermore, the type-II band alignment in vertically stacked TMD heterojunctions effectively facilitates photogenerated carrier separation and inhibits electron–hole recombination (
The heterojunction that is a combination of TMDs and zinc oxide (ZnO) has attracted much interest among researchers in recent years (
The type I band alignment based on semiconducting TMDs shows great application potential in photonic and photoelectric devices with ultrafast (∼100 fs) interface response and charge transfer velocity (
Currently, both type-I and type-II band alignment are common in vdWHs, while few systems show type-III images. Type-III heterojunctions, as previously mentioned, have a broken bandgap, which is appropriate for tunneling field effect transistors (
In addition to TMDs, other vdW layered semiconductors have been developed rapidly in the field of heterojunctions. For instance, the heterojunction composed of the metal monochalcogenides InSe and GeSe and Xenes arsenene. The InSe/GeSe vdWH shows a band alignment with a near-zero bandgap which can simplify the reversing circuit and speed regulating circuit; therefore, the field effect transistor (FET) based on the InSe/GeSe vdW heterojunction is suitable for constructing as a gate-controllable half-wave rectifier (
For 2D type-II heterojunctions, it is critical for the conduction and valence band edges to be momentum-matched (
Due to the quantum confinement effect, the electronic band structure, polarization, and optical properties of layered materials can be easily affected by the thickness (
Semiconductor thickness can also control the carrier migration. That is, the performance of metal–2D semiconductor junctions, especially the interface barrier which represents the barrier to be crossed for carrier migration, is thickness-dependent. The Fermi-level pinning factor of metal–2D multilayered semiconductor junctions depends sensitively on the layer number of few-layer 2D semiconductors (
The ultrathin character allows the electronic properties of 2D materials to be tuned by external electric fields, which provides a feasible method for band arrangement in 2D heterojunctions (
Due to the existence of the internal electric field, the Janus heterojunction shows different characteristics under the action of the external electric field. In Janus-In2STe/InSe vdWHs, both strain and the electric field can cause direct–indirect band structure transformation and staggered-straddling band alignment (
As stated above, the novel strategy of the external electric field plays an important role in modulating electronic characteristics for vdW heterojunctions. Strain, including vertical and biaxial, often discussed together with the electric field, is also an effective method to regulate the electric properties such as conductivity and transportability of low-dimensional semiconductor systems (
Especially, the biaxial strain engineering is effective in modulating the bandgaps of 2D heterojunctions (
For 2D heterojunctions, tensile strain also provides an approach to enhance light absorption and improve solar energy conversion efficiency. As in SnS2/WSe2 heterojunctions, with compressive strain exceeding –9%, the indirect type-II semiconductor will transform to a type-I semiconductor which provides theoretical basis for future practical application (
3 Application in Optoelectronic and Electronic Devices
VdWHs, with their on-demand design capabilities, offer amazing opportunities to build new types of electronic and optoelectronic devices (
In type-II band arrangement vdWHs, photo-induced electrons and holes tend to move in opposite directions, resulting in high separation efficiency of charge carriers, which provides novel exciton devices with large binding energy (
FIGURE 2

(A) MoSe2−WSe2 vdWH used in interlayer exciton optoelectronics (
Hydrogen is a secondary source of energy which can be obtained from other major energy sources (
These results establish the foundation for utilizing the interlayer exciton and photocatalysis in future 2D heterojunction optoelectronic devices. Simultaneously, the 2D materials are promising for future two-terminal devices, transistors, and memories because of their surface dangling free bonds, atomically thin body, atomically sharp heterojunctions, and band alignments through the modulating method described above. For example, heterojunctions with type-III band alignment can actuate Esaki diodes with significant negative differential resistance, heterojunctions with p–n junctions enable vertical TFETs with an ultra-steep subthreshold slope, and the atomically thin body supplies 2D heterojunction transistors with strong immunity against short-channel effects. In electronic devices, the high contact resistance is an obstacle to realizing the potential of these materials for low-power applications. MoS2 is the outstanding representative of two-dimensional semiconductors, and the reported contact resistance of metal−MoS2 is 10 times higher than that of Si (
However, there are many challenges and limitations in 2D optoelectronic and electronic devices, such as high-quality large-scale synthesis and large contact resistances. Further research and efforts are needed before the actual applications (
4 Conclusion and Perspectives
In summary, this article provides a brief review of 2D layered materials and their vdWHs based on band alignment engineering and their applications in optoelectronic and electronic devices. In the first, three types of band alignments and their carrier transport characteristics at interfaces are introduced. Subsequently, band alignment regulation and control methods are listed, including composition modulation, layer thickness adjustment, strain, and electric field. Finally, optoelectronic and electronic devices based on 2D heterojunctions are summarized.
Although 2D layered materials have many attractive properties and advantages, there are still many problems to be overcome before their applications in reality, such as the preparation of large size and high-quality 2D materials and 2D heterojunctions. What is more, high interfacial resistance is also holding it back. Much research and development efforts should be input before 2D semiconductor devices will be ready for mainstream applications. In a word, 2D semiconductors and their heterojunctions would be a hot topic in future research and can potentially have broad applications.
Statements
Author contributions
All authors listed have made a substantial, direct, and intellectual contribution to the work and approved it for publication.
Funding
This work was financially supported by the Natural Science Foundation of Hubei Province of China (No. 2020CFB245); Teaching Research Projects in Colleges and Universities of Hubei (No. 2020668); and Hubei Province Education Department Scientific Research Plan Guiding Project (No. B2021260).
Conflict of interest
The authors declare that the research was conducted in the absence of any commercial or financial relationships that could be construed as a potential conflict of interest.
Publisher’s note
All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors, and the reviewers. Any product that may be evaluated in this article, or claim that may be made by its manufacturer, is not guaranteed or endorsed by the publisher.
Supplementary material
The Supplementary Material for this article can be found online at: https://www.frontiersin.org/articles/10.3389/fenrg.2021.802055/full#supplementary-material
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Summary
Keywords
2D semiconductor heterojunction, band alignment, strain, electric field, optoelectronics
Citation
Wang Q, Zhang L, Liu X and Li S (2021) Two-Dimensional Semiconductor Heterojunctions for Optoelectronics and Electronics. Front. Energy Res. 9:802055. doi: 10.3389/fenrg.2021.802055
Received
26 October 2021
Accepted
15 November 2021
Published
20 December 2021
Volume
9 - 2021
Edited by
Chao Han, University of Technology Sydney, Australia
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Copyright
© 2021 Wang, Zhang, Liu and Li.
This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) and the copyright owner(s) are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
*Correspondence: Sha Li, lisha@hue.edu.cn
This article was submitted to Electrochemical Energy Conversion and Storage, a section of the journal Frontiers in Energy Research
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