Your new experience awaits. Try the new design now and help us make it even better

REVIEW article

Front. Mech. Eng.

Sec. Solid and Structural Mechanics

This article is part of the Research TopicAdvanced Fabrication Techniques for High-Precision Optical ComponentsView all 5 articles

A Comprehensive Review on Femtosecond Laser Polishing of Silicon Nitride: Fundamentals, Current Progress, and Industrial Outlook

Provisionally accepted
  • 1Mahanakorn University of Technology, Bangkok, Thailand
  • 2King Mongkut's Institute of Technology Ladkrabang, Lat Krabang District, Thailand

The final, formatted version of the article will be published soon.

Silicon nitride ("S" "i" _"3" "N" _"4" ) ceramics are indispensable in aerospace bearings and semiconductor substrates due to their exceptional mechanical and thermal properties. However, achieving damage-free, atomic-level surface finishes remains problematic. Traditional mechanical polishing induces subsurface microcracks, while chemical mechanical polishing (CMP) is plagued by low material removal rates and environmental toxicity. This review critically evaluates femtosecond laser polishing as a transformative, "green" non-contact alternative. We first elucidate the laser-matter interaction mechanisms specific to wide-bandgap "S" "i" _"3" "N" _"4" ("E" _"g" "≈5.3" eV), clarifying how multiphoton absorption enables "cold ablation" by suppressing the heat-affected zone (HAZ) via the two-temperature model (TTM) dynamics. A distinct material removal mechanism driven by rapid thermal decomposition ("S" "i" _"3" "N" _"4" "→Si+" "N" _"2" ) and phase explosion is highlighted. Synthesizing recent experimental data, we establish a quantitative process window. Operating slightly above the ablation threshold ("F≈1.4" 〖" J/cm" 〗^"2" ) with high spot overlap (70–90%) is critical to balance surface leveling against the incubation effect, which otherwise triggers porosity. Furthermore, we address the unique challenges of inducing periodic structures (LIPSS) on dielectric surfaces and propose a hybrid manufacturing strategy—integrating high-speed laser roughing with CMP finishing—to resolve efficiency constraints. Finally, an industrial roadmap involving high-throughput polygon scanners and AI-driven closed-loop control is outlined, providing a comprehensive reference for advancing femtosecond laser polishing toward scalable, high-precision manufacturing.

Keywords: Cold ablation mechanism, Femtosecond laser polishing, Green Manufacturing, Hybrid polishing strategy, incubation effect, Silicon nitride (Si3N4)

Received: 05 Oct 2025; Accepted: 22 Dec 2025.

Copyright: © 2025 Jian, Pimsarn, Chuwattanakul and Eiamsa-ard. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.

* Correspondence: Varesa Chuwattanakul

Disclaimer: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article or claim that may be made by its manufacturer is not guaranteed or endorsed by the publisher.