Abrasive Machining of the CMC or Brittle Material

Brittle materials (such as ceramics, glass, semiconductors, optical crystals, etc.) are widely used in key fields such as aerospace, precision optics, electronic packaging, and biomedicine due to their high hardness, high temperature resistance, and excellent insulation properties. However, their low fracture toughness and high brittleness make them extremely prone to cracking, edge chipping, surface damage, and other issues during machining, leading to low efficiency in traditional processing techniques (such as turning and milling), or even failing to meet the requirements of precision manufacturing. With the development of advanced manufacturing technologies, new processes such as ultrasonic-assisted machining, laser machining, abrasive waterjet machining, and electrical discharge machining (EDM) have gradually become research hotspots in brittle material machining. However, challenges such as unclear material removal mechanisms, difficulty in optimizing processing parameters, and severe tool wear still exist.

Additionally, emerging industries such as new energy and microelectronics have set higher requirements for micro/nano-scale machining, complex structure forming, and multi-material integrated manufacturing of brittle materials, urgently requiring interdisciplinary theoretical and technological breakthroughs. Therefore, systematic research on the basic theories, process innovations, and engineering applications of brittle material machining is of great significance for promoting the development of high-end manufacturing.

With this research topic, we have the purpose to:

1. Reveal common mechanisms in brittle material machining, such as crack initiation and propagation mechanisms, thermo-mechanical-chemical coupling laws, and material removal behavior at the nanoscale;
2. Develop efficient and low-damage machining processes: break through the limitations of traditional machining and explore new technologies such as hybrid machining (e.g., ultrasonic-laser synergistic processing) and integrated additive-subtractive manufacturing;
3. Optimize machining systems and equipment: design new cutting tools/abrasives, intelligent sensors, and control systems to improve machining accuracy and stability;
4. Promote interdisciplinary applications: facilitate the cross-integration of materials science, mechanics, optics, and manufacturing technology to solve key manufacturing challenges in aerospace components, optical elements, semiconductor devices, and other fields.


This research topic covers all research in brittle material machining, including but not limited to:

1. Basic Theories
• Mechanical behavior of brittle materials (fracture mechanics, fatigue damage, nanomechanics);
• Thermoelastic coupling, tribological characteristics, and multi-physical field coupling modeling during machining;
• Quantum effects and interfacial behavior in micro/nano-scale machining.

2. Machining Processes and Technologies
• Improvement of traditional processes: process optimization and intelligentization of precision grinding, lapping, and polishing;
• Non-traditional machining technologies: energy regulation and damage suppression in laser machining, electron beam machining, and ion beam machining;
• Hybrid machining processes: ultrasonic/vibration-assisted machining, electrochemical-mechanical hybrid machining, ice grinding, etc.;
• Additive manufacturing: defect control and performance optimization in ceramic 3D printing and glass micro/nano forming.

3. Tools and Equipment
• Design and wear mechanisms of superhard cutting tools (diamond, CBN);
• Intelligent machining equipment: precision improvement and chatter suppression in five-axis CNC machine tools and robotic machining systems;
• Online monitoring and control technologies: application of acoustic emission monitoring and machine vision in machining.

4. Engineering Applications
• Aerospace: machining of ceramic matrix composites (CMC) components;
• Optics: nanoscale surface machining of precision glass elements (e.g., lenses, prisms);
• Semiconductor: high-efficiency cutting and polishing of silicon wafers and silicon carbide (SiC) substrates;
• Biomedicine: precise machining of brittle biomaterials (e.g., bone repair devices).

5. Key Specific Research Directions
• Material Properties & Modeling: Constitutive modeling, numerical simulations (FEM, molecular dynamics), multi-scale multi-physics modeling;
• Novel Machining Techniques: Laser-induced crack control, ultrasonic vibration-assisted grinding, waterjet parameter optimization, EDM electrode wear compensation;
• Tool & Abrasive Technologies: Ultra-hard abrasive wheel design, diamond tool coatings, self-healing grinding tools;
• Micro/Nano Machining: Focused ion beam (FIB) milling, AFM nanolithography, soft lithography for glass microfluidic chips;
• Quality Control & Inspection: Surface integrity evaluation (roughness, subsurface damage), in-situ inspection, and error compensation.