Advances in the Thermal Management of Electronics

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About this Research Topic

Submission deadlines

  1. Manuscript Submission Deadline 31 March 2026

  2. This Research Topic is currently accepting articles.

Background

The rapid evolution of electronics has led to the development of increasingly powerful and compact devices. However, this progress has also introduced significant thermal management challenges. Heat generation in electronic devices can degrade performance, reduce reliability, and shorten lifespan if not properly managed. Consequently, effective thermal management has become a focal point for engineers and researchers aiming to enhance the efficiency and durability of electronic systems.

This Research Topic will delve into the latest advancements in the thermal management of electronics, a crucial field which underpins the performance, reliability, and longevity of modern electronic devices. The Topic will bring together cutting-edge research and innovative approaches from leading experts in the field to provide a comprehensive overview of the state-of-the-art techniques and future directions in the thermal management of electronics, offering valuable insights for researchers, engineers, and industry professionals dedicated to solving the challenges in the field.

Research areas within the scope of this Topic include, but are not limited to, the following:
• Nanotechnology and Advanced Materials: Exploration of novel materials with superior thermal conductivity and their integration into electronic systems for enhanced heat dissipation
• Heat Sinks and Heat Spreaders: Developments in heat sink designs and materials, including the use of phase-change materials and micro-channel heat exchangers
• Active Cooling Techniques: Innovations in liquid cooling, thermoelectric cooling, and hybrid cooling systems that offer higher efficiency and adaptability
• Modeling and Simulation: Advances in computational methods for predicting thermal behavior and optimizing thermal management strategies in electronic devices
• Thermal Interface Materials (TIMs): Improvements in TIMs that provide better thermal coupling between components, reducing thermal resistance and enhancing heat transfer
• Emerging Technologies: Insights into emerging trends such as two-phase cooling, microfluidics, and the use of artificial intelligence for real-time thermal management.

Article types and fees

This Research Topic accepts the following article types, unless otherwise specified in the Research Topic description:

  • Brief Research Report
  • Data Report
  • Editorial
  • FAIR² Data
  • Hypothesis and Theory
  • Methods
  • Mini Review
  • Opinion
  • Original Research

Articles that are accepted for publication by our external editors following rigorous peer review incur a publishing fee charged to Authors, institutions, or funders.

Keywords: thermal management, electronics, thermal interface materials, active cooling techniques, heat sinks, heat spreaders, nanotechnology, advanced materials, heat exchangers, liquid cooling, two-phase cooling, micro-fluidics, thermal coupling, heat dissipation

Important note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.

Topic editors

Manuscripts can be submitted to this Research Topic via the main journal or any other participating journal.

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