Micro-nano electromechanical systems (MEMS/NEMS) have revolutionized various fields, including electronics, biotechnology, and environmental monitoring. These systems integrate mechanical and electrical components at the micro- and nano-scales, enabling the development of highly sensitive and precise devices. The design and fabrication of functional micro-nano structures—such as resonant sensors, energy harvesters, and lab-on-chip devices—require cutting-edge technologies to achieve sub-micron accuracy, material compatibility, and robustness. Advances in lithography, additive manufacturing, and surface engineering have enabled tailored architectures with enhanced mechanical, electrical, or chemical properties. As applications expand into quantum technologies and smart materials, the synergy between computational modeling and novel processing methods remains critical to overcoming scalability and integration challenges in MEMS/NEMS development.
This study aims to address critical challenges in the design and fabrication of functional micro-nano structures for MEMS/NEMS applications, particularly in achieving scalable manufacturing, material compatibility, and structural robustness. Key issues include: (1) overcoming trade-offs between resolution and throughput in nanofabrication, (2) ensuring multi-material integration without interfacial degradation, and (3) enhancing dynamic stability of high-aspect-ratio architectures under operational stresses.
Computational design frameworks, including topology optimization guided by machine learning, will enable predictive modeling of multi-physics coupling (e.g., thermo-mechanical-electrical interactions). Recent breakthroughs in hybrid lithography (e.g., nanoimprint combined with direct laser writing) and self-assembly of metamaterials offer pathways for defect-tolerant manufacturing. Additionally, heterogeneous integration strategies—such as transfer printing of 2D materials onto silicon substrates—will bridge material incompatibility gaps.
The integration of in-situ metrology tools (e.g., SEM-based nanomanipulation) and AI-driven process control will ensure real-time quality assurance. By synergizing these innovations, this work targets the development of next-generation MEMS/NEMS with enhanced functionality, reliability, and manufacturability.
This topic focuses on innovative strategies for designing and fabricating functional micro-nano structures tailored for MEMS/NEMS, flexible electronics, and smart material systems. Specific areas of interest include:
2. Multi-material integration and interfacial engineering for heterogeneous systems (e.g., 2D materials on silicon, polymer-metal composites).
3 . Computational design frameworks leveraging machine learning and topology optimization for multi-physics-coupled structures.
4. Scalable manufacturing approaches, including self-assembly, roll-to-roll processing, et al..
5. In-situ characterization and AI-driven process control for real-time quality assurance.
We welcome original research articles, reviews, and technical briefs that bridge theoretical modeling, experimental validation, and industrial scalability. Submissions exploring emerging applications in quantum sensors, bio-integrated devices, and energy-efficient systems are particularly encouraged.
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