ORIGINAL RESEARCH article
Front. Mater.
Sec. Thin Solid Films
Volume 12 - 2025 | doi: 10.3389/fmats.2025.1527753
This article is part of the Research TopicThin Solid Films: From Advanced Green Production Methods to Their Environmental UsesView all articles
Investigating the influence of a thin copper film coated on nickel plates through physical vapor deposition for electrocatalytic nitrate reduction
Provisionally accepted
Sumit Maya Moreshwar Meshram*
Prasad Gonugunta
Ludovic Jourdin
Nick Van De Giesen
Peyman Taheri
Saket Pande- Delft University of Technology, Delft, Netherlands
Select one of your emails
You have multiple emails registered with Frontiers:
Notify me on publication
Please enter your email address:
If you already have an account, please login
You don't have a Frontiers account ? You can register here
The removal of nitrate (NO3-) from water and its subsequent valorization for various applications are crucial due to environmental, health, and economic considerations. A promising method for its removal is the process of electrocatalytic reduction of nitrate. Copper/nickel (Cu/Ni) composite electrodes have demonstrated potential for this process in aqueous solution, however, the effect of thin Cu film coated on Ni using physical vapor deposition (PVD) has not been investigated for NO3- removal. Here, the PVD technique was employed to deposit a thin film of Cu onto a Ni plate to form Cu-Ni composite electrodes of varying Cu thicknesses (25 -100 nm), enabling the investigation of the influence of the Cu film thickness on NO3- reduction. Electrodes prepared using PVD were utilized for electrocatalytic nitrate reduction (NO3RR) for the first time. The Cu-Ni electrodes were analyzed using X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM) to examine the deposited Cu film which is critical for NO3- reduction and ammonium (NH4+) selectivity. The Cu film was found to be uniformly distributed on the Ni plate without any additional contamination. Cyclic voltammetry was performed to obtain the information on electron transfer between the Cu-Ni electrode and the nitrogen (N2) species on the surface. NO3- was primarily reduced to NH4+, with no significant difference in the NO3- conversion rate observed as a function of the Cu thickness. As the Cu thickness increased, the current density decreased. This study also investigated the effect of stirring on NO3- reduction, considering potential applications where rotation or stirring is not feasible such as in some batteries. The findings of this investigation indicate that thin film coated electrodes fabricated using the PVD method exhibit capability for NO3- elimination through electrocatalytic reduction processes.
Keywords: physical vapor deposition, Electrocatalytic nitrate reduction, copper-nickel electrode, thickness, XPS, SEM
Received: 13 Nov 2024; Accepted: 21 Apr 2025.
Copyright: © 2025 Meshram, Gonugunta, Jourdin, Van De Giesen, Taheri and Pande. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
* Correspondence: Sumit Maya Moreshwar Meshram, Delft University of Technology, Delft, Netherlands
Disclaimer: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article or claim that may be made by its manufacturer is not guaranteed or endorsed by the publisher.