Correction ARTICLE

Front. Chem., 25 May 2020 | https://doi.org/10.3389/fchem.2020.00445

Corrigendum: Physical Organohydrogels With Extreme Strength and Temperature Tolerance

  • 1College of Bioresources Chemical and Materials Engineering, Shaanxi University of Science & Technology, Xi'an, China
  • 2National Demonstration Center for Experimental Light Chemistry Engineering Education (Shaanxi University of Science & Technology), Xi'an, China
  • 3State Key Laboratory for Strength and Vibration of Mechanical Structures, International Center for Applied Mechanics, School of Aerospace Engineering, Xi'an Jiaotong University, Xi'an, China
  • 4Research Center for Semiconductor Materials and Devices, College of Arts and Sciences, Shaanxi University of Science & Technology, Xi'an, China

A Corrigendum on
Physical Organohydrogels With Extreme Strength and Temperature Tolerance

by Zhang, J. W., Dong, D. D., Guan, X. Y., Zhang, E. M., Chen, Y. M., Yang, K., et al. (2020). Front. Chem. 8:102. doi: 10.3389/fchem.2020.00102

In the published article there was an error in the Funding statement. The correct number for the Key Research and Development Program of Shaanxi is “2020KWZ-006.” The correct number for the Xi'an Weiyang District Science and Technology Fund is “201927.”

The authors apologize for this error and state that this does not change the scientific conclusions of the article in any way. The original article has been updated.

Keywords: organohydrogels, high strength, anti-freezing, non-drying, temperature tolerance

Citation: Zhang JW, Dong DD, Guan XY, Zhang EM, Chen YM, Yang K, Zhang YX, Khan MMB, Arfat Y and Aziz Y (2020) Corrigendum: Physical Organohydrogels With Extreme Strength and Temperature Tolerance. Front. Chem. 8:445. doi: 10.3389/fchem.2020.00445

Received: 27 April 2020; Accepted: 28 April 2020;
Published: 25 May 2020.

Approved by:

Frontiers Editorial Office, Frontiers Media SA, Switzerland

Copyright © 2020 Zhang, Dong, Guan, Zhang, Chen, Yang, Zhang, Khan, Arfat and Aziz. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) and the copyright owner(s) are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.

*Correspondence: Yong Mei Chen, chenyongmei@sust.edu.cn

These authors have contributed equally to this work