REVIEW article
Front. Food Sci. Technol.
Sec. Food Packaging and Preservation
This article is part of the Research TopicInnovative Biodegradable Packaging Materials for Food PreservationView all articles
Recent Trends and Innovations in Smart and AI-based Food Packaging: A Review
Provisionally accepted
- Chandigarh University, Mohali, India
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Food packaging is crucial for ensuring food safety, maintaining product quality, and reducing food waste. However, traditional packaging systems cannot provide real-time information or predictions about product status. This limitation impacts supply chain visibility and effective shelf-life management. To address these issues, integrating artificial intelligence (AI) with innovative packaging methods, such as smart, active, intelligent, and biodegradable packaging, has become a promising approach. AI-enabled food packaging creates more responsive, accurate, and sustainable systems. It allows for real-time spoilage detection, predicts shelf-life, and improves traceability through machine learning and blockchain technologies. This review discusses recent advancements in AI-integrated smart packaging. It includes AI-driven freshness sensors, data-driven traceability systems, and eco-friendly packaging materials, showcasing their potential to enhance food safety, improve supply chain efficiency, and reduce food waste. Furthermore, it emphasizes future research directions. These focus on next-generation biodegradable smart sensors, advanced machine learning models for predictions, and developing sustainable, scalable packaging systems to strengthen global food security.
Keywords: Artificial intelligence (AI), Blockchain, Food Safety, Smart packaging, traceability
Received: 13 Jul 2025; Accepted: 22 Dec 2025.
Copyright: © 2025 Sagar and Rani. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
* Correspondence: Narashans Alok Sagar
Disclaimer: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article or claim that may be made by its manufacturer is not guaranteed or endorsed by the publisher.