ORIGINAL RESEARCH article

Front. Mater.

Sec. Computational Materials Science

Volume 12 - 2025 | doi: 10.3389/fmats.2025.1605771

Rapid Mold Optimization Based on Ultraviolet Curing 3D Printing Technology

Provisionally accepted
Hanyu  RaoHanyu Rao1Xinyu  BaiXinyu Bai1Weni  YanWeni Yan1Jie  LiuJie Liu2*
  • 1Materials Science and Engineering, Nanjing University of Technology, Nanjing, 211816, China, Nanjing, China
  • 2Nanjing Tech University, Nanjing, China

The final, formatted version of the article will be published soon.

Injection molding is the most common method for making plastic products. However, quick molds made with ultraviolet (UV) curing 3D printing frequently employ photosensitive resins with low mechanical strength, rendering plastic components prone to warpage deformation. To solve this issue, our research focuses on the design and development of fast molds using UV-curing 3D printing technology. A response surface model was used to explore the effect of different process parameters on component warpage, with the goal of minimizing deformation. An upgraded particle swarm optimization (PSO) technique was then created to fine-tune the process parameters and reduce warpage even more. The results revealed that raising injection pressure, reducing temperature, and prolonging holding time successfully reduced warpage. During the single-peak Schwefel function test, the modified PSO method displayed greater optimization capabilities, achieving convergence in around 40 iterations. Using the modified values, the maximum warpage was lowered by 0.55 mm. Experimental results demonstrate the suggested optimization model's performance, allowing for increased mold design flexibility and aiding the industry's migration to digital and customized production.

Keywords: Ultraviolet curing 3D printing, Rapid mold, Particle swarm optimization algorithm, Photosensitive resin, Viscosity

Received: 03 Apr 2025; Accepted: 13 Jun 2025.

Copyright: © 2025 Rao, Bai, Yan and Liu. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.

* Correspondence: Jie Liu, Nanjing Tech University, Nanjing, China

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