ORIGINAL RESEARCH article
Front. Mater.
Sec. Polymeric and Composite Materials
Volume 12 - 2025 | doi: 10.3389/fmats.2025.1623918
This article is part of the Research TopicAdvanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and ReliabilityView all 8 articles
Integrated Approaches to Selection Control, Microstructural Analysis, and Reliability Assessment for Bare Dies
Provisionally accepted
- China Aerospace Science & Industry Corp. Defense Technology R&T Center, beijing, China
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Due to the limitations of device size and weight, under the demand for multi-functionality, high precision, and high reliability of devices, the bare die was adopted to instead of packaged components. By using dies directly without packaging, costs were reduced to a certain extent. However, without packaging protection, higher requirements on quality and reliability were imposed to bare die. Based on system reliability, a comprehensive assessment must be made from aspects such as selection control, structural management, functional performance, and environmental adaptability. When the typical die was initially selected, based on the application reliability risk analysis of bare die, reliability evaluation projects were designed, and the reliability evaluation scheme was confirmed, the functionality,performance, reliability and adaptability of bare die were evaluated. The practical results had proven that the integrated evaluation method can effectively avoid the use of components with quality risks or insufficient reliability and the goal of reducing costs while ensuring product quality and reliability had been achieved to a certain extent.
Keywords: Bare die, Integrated approaches, Application reliability, Selection control, risk analysis
Received: 06 May 2025; Accepted: 21 Jul 2025.
Copyright: © 2025 liang, Rongrong, Wen qian, Yang and Ruiyuan. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
* Correspondence:
MEI liang, China Aerospace Science & Industry Corp. Defense Technology R&T Center, beijing, China
Wu Rongrong, China Aerospace Science & Industry Corp. Defense Technology R&T Center, beijing, China
Disclaimer: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article or claim that may be made by its manufacturer is not guaranteed or endorsed by the publisher.