MINI REVIEW
Published on 24 Apr 2025
Research progress in interface optimization and preparation technology of high thermal conductivity diamond/copper composite materials
doi 10.3389/fmats.2025.1582990
- 722 views
- Frontiers in Materials
- Polymeric and Composite Materials
- Research Topics
- Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
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Published on 02 Sep 2024
Lifetime prediction of copper pillar bumps based on fatigue crack propagation
doi 10.3389/fmats.2024.1470365
- 1,403 views
- 1 citation
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