ORIGINAL RESEARCH
Published on 10 Sep 2025
Integrated approaches to selection control, microstructural analysis, and reliability assessment for bare dies
doi 10.3389/fmats.2025.1623918
- 962 views
- Frontiers in Materials
- Polymeric and Composite Materials
- Research Topics
- Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
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Articles
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doi 10.3389/fmats.2025.1668151
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doi 10.3389/fmats.2025.1655566
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doi 10.3389/fmats.2025.1582990
- 1,617 views
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doi 10.3389/fmats.2025.1584349
- 1,536 views
- 1 citation
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Microstructure, interfacial reaction and shearing property of Sn-58Bi solder joints reinforced by Zn particles during isothermal aging
doi 10.3389/fmats.2025.1581900
- 967 views
- 1 citation
REVIEW
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Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
doi 10.3389/felec.2024.1515860
- 12,536 views
- 4 citations
REVIEW
Published on 24 Dec 2024
Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials
doi 10.3389/fmats.2024.1532859
- 1,344 views
ORIGINAL RESEARCH
Published on 02 Sep 2024
Lifetime prediction of copper pillar bumps based on fatigue crack propagation
doi 10.3389/fmats.2024.1470365
- 2,050 views
- 1 citation
