EDITORIAL
Published on 17 Oct 2025
Editorial: Advanced electronic packaging materials: Constitutive model, simulation, design and reliability
doi 10.3389/fmats.2025.1702323
- 703 views
- Frontiers in Electronic Materials
- Semiconducting Materials and Devices
- Research Topics
- Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
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Articles
ORIGINAL RESEARCH
Published on 10 Sep 2025
Integrated approaches to selection control, microstructural analysis, and reliability assessment for bare dies
doi 10.3389/fmats.2025.1623918
- 1,326 views
ORIGINAL RESEARCH
Published on 14 Aug 2025
Research on hydrogen induced cracking behavior and service performance of metal pipeline material
doi 10.3389/fmats.2025.1668151
- 1,661 views
MINI REVIEW
Published on 30 Jul 2025
Research progress in the relationship between packaging structures and service performance of MEMS inertial sensors
doi 10.3389/fmats.2025.1655566
- 1,802 views
- 1 citation
MINI REVIEW
Published on 24 Apr 2025
Research progress in interface optimization and preparation technology of high thermal conductivity diamond/copper composite materials
doi 10.3389/fmats.2025.1582990
- 1,921 views
- 1 citation
MINI REVIEW
Published on 15 Apr 2025
Review on the impact of marine environment on the reliability of electronic packaging materials
doi 10.3389/fmats.2025.1584349
- 1,850 views
- 1 citation
ORIGINAL RESEARCH
Published on 26 Mar 2025
Microstructure, interfacial reaction and shearing property of Sn-58Bi solder joints reinforced by Zn particles during isothermal aging
doi 10.3389/fmats.2025.1581900
- 1,063 views
- 1 citation
REVIEW
Published on 03 Feb 2025
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
doi 10.3389/felec.2024.1515860
- 15,393 views
- 8 citations
REVIEW
Published on 24 Dec 2024
Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials
doi 10.3389/fmats.2024.1532859
- 1,531 views
- 1 citation
ORIGINAL RESEARCH
Published on 02 Sep 2024
Lifetime prediction of copper pillar bumps based on fatigue crack propagation
doi 10.3389/fmats.2024.1470365
- 2,219 views
- 1 citation
Published in
Frontiers in Electronic Materials
Semiconducting Materials and Devices
Participating Journals
Frontiers in Materials
- 2.9 impact factor
- 5.6 citescore