EDITORIAL
Accepted on 07 Oct 2025
Editorial: Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
doi 10.3389/fmats.2025.1702323
- 100 views
- Frontiers in Electronic Materials
- Semiconducting Materials and Devices
- Research Topics
- Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
Advanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and Reliability
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Articles
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Integrated approaches to selection control, microstructural analysis, and reliability assessment for bare dies
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Research progress in the relationship between packaging structures and service performance of MEMS inertial sensors
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- 1 citation
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ORIGINAL RESEARCH
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Microstructure, interfacial reaction and shearing property of Sn-58Bi solder joints reinforced by Zn particles during isothermal aging
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- 1,028 views
- 1 citation
REVIEW
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Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
doi 10.3389/felec.2024.1515860
- 14,143 views
- 8 citations
REVIEW
Published on 24 Dec 2024
Review on multi-scale mechanics fundamentals and numerical methods for electronics packaging interconnect materials
doi 10.3389/fmats.2024.1532859
- 1,447 views
- 1 citation
ORIGINAL RESEARCH
Published on 02 Sep 2024
Lifetime prediction of copper pillar bumps based on fatigue crack propagation
doi 10.3389/fmats.2024.1470365
- 2,128 views
- 1 citation
Published in
Frontiers in Electronic Materials
Semiconducting Materials and Devices
Participating Journals
Frontiers in Materials
- 2.9 impact factor
- 5.6 citescore