MINI REVIEW article
Front. Mater.
Sec. Polymeric and Composite Materials
Volume 12 - 2025 | doi: 10.3389/fmats.2025.1655566
This article is part of the Research TopicAdvanced Electronic Packaging Materials: Constitutive Model, Simulation, Design and ReliabilityView all 7 articles
Research progress in the relationship between packaging structures and service performance of MEMS inertial sensors
Provisionally accepted
- 1Shaanxi Energy Institute, xianyang, China
- 2Beihang University School of Instrumentation Science and Opto-electronics Engineering, Beijing, China
- 3Aerospace Times Electronic Technology Co Ltd, Beijing, China
Select one of your emails
You have multiple emails registered with Frontiers:
Notify me on publication
Please enter your email address:
If you already have an account, please login
You don't have a Frontiers account ? You can register here
In recent years, micro-electro-mechanical systems (MEMS) technology has advanced rapidly, leading to widespread adoption of MEMS inertial sensors in areas such as consumer electronics, industrial automation, national defense, and military systems. These sensors offer notable advantages, including compact size, low cost, and ease of large-scale production. This study provides a comprehensive review of recent research, both domestic and international, focusing on how variations in packaging design affect the performance of MEMS inertial sensors across consumer-grade, industrial-grade, and tactical-grade classifications. Typical sensor models, including the MPU9250, ADIS16470, and the tactical-grade HG1930, are selected as representative examples. The influence of different packaging types-such as quad flat no-lead (QFN), ceramic leadless chip carrier (LCC), and hermetic metal vacuum packaging-on key performance metrics such as bias stability, noise density, and temperature drift is analyzed in depth. Moreover, the influence mechanism of electronic packaging design on inertial sensors is explained from the perspective of the coupling of thermal-mechanical-electrical multi-physics models. Finally, this paper explores the development potential of emerging packaging technologies, including heterogeneous integration, intelligent compensation, and quantum-level techniques, in driving future performance breakthroughs in MEMS inertial sensors.
Keywords: Packaging structure, MEMS, Inertial sensors, service performance, IMU
Received: 28 Jun 2025; Accepted: 16 Jul 2025.
Copyright: © 2025 Liu, Yang, Jia, Zhang, Pang and Huang. This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) or licensor are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
* Correspondence: Xu Yang, Shaanxi Energy Institute, xianyang, China
Disclaimer: All claims expressed in this article are solely those of the authors and do not necessarily represent those of their affiliated organizations, or those of the publisher, the editors and the reviewers. Any product that may be evaluated in this article or claim that may be made by its manufacturer is not guaranteed or endorsed by the publisher.